Tokyo, Japan

Tomomitsu Watanabe

This inventor holds 1 USPTO granted patent. Top assignee: Sankyo Oilless Industry, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tomomitsu Watanabe. Retrieved from https://idiyas.com/inventor/tomomitsu-watanabe

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Tomomitsu Watanabe and Sliding-Material Innovation.

Introduction

Tomomitsu Watanabe is an inventor associated with Tokyo, Japan, and Sankyo Oilless Industry, Inc. His listed patent concerns a sliding material designed to improve slidability.

Latest Patents

Watanabe is credited with 1 patent, titled “Sliding material.” The invention describes a substrate comprising a brass alloy and a Cr—Fe—Si-based intermetallic compound within the substrate. Regions where the compound precipitates have a nanoindentation hardness of 20 to 28 GPa. The patent presents this material structure as a way to improve sliding performance.

Career Highlights

Watanabe’s listed work connects materials engineering with the development of sliding components. His patent focuses on the composition and hardness of the material, characteristics relevant to its intended slidability.

Collaborations

Watanabe’s listed coworkers include Kohei Susumu and Masahito Fujita. The available information identifies his company as Sankyo Oilless Industry, Inc.

Conclusion

Tomomitsu Watanabe’s recorded patent highlights an approach to improving sliding performance through a brass-alloy substrate containing a hard Cr—Fe—Si-based intermetallic compound.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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