Osaka, Japan

Tomokuni Mitsui


Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: The Innovations of Tomokuni Mitsui

Introduction

Tomokuni Mitsui is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of materials science, particularly in the development of lead-free solder. His innovative approach addresses environmental concerns associated with traditional solder materials.

Latest Patents

Mitsui holds a patent for a lead-free solder that contains 93.0 mass % or more and 98.95 mass % or less of indium. This solder also includes 1.0 mass % or more and 4.0 mass % or less of tin, along with an addition metal. The addition metal can be one of silver, antimony, copper, or nickel, but it is neither indium nor tin. The total mass percentage of the addition metal is between 0.05 mass % and 6.0 mass %. The combined mass percentages of the addition metal, indium, and tin do not exceed 100 mass %.

Career Highlights

Mitsui is currently employed at Uchihashi Estec Co., Ltd., where he continues to innovate in the field of solder materials. His work has been instrumental in advancing lead-free technologies, which are crucial for sustainable manufacturing practices.

Collaborations

Mitsui collaborates with talented colleagues such as Yoshihiro Yoshioka and Kazuo Inada. Their combined expertise fosters a creative environment that encourages the development of cutting-edge solutions in materials science.

Conclusion

Tomokuni Mitsui's contributions to lead-free solder technology exemplify his commitment to innovation and sustainability. His work not only addresses industry needs but also promotes environmentally friendly practices in manufacturing.

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