The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2023
Filed:
May. 25, 2022
Applicant:
Uchihashi Estec Co., Ltd., Osaka, JP;
Inventors:
Yoshihiro Yoshioka, Osaka, JP;
Kazuo Inada, Osaka, JP;
Tomokuni Mitsui, Osaka, JP;
Hitoshi Yamanaka, Osaka, JP;
Assignee:
Uchihashi Estec Co., Ltd., Osaka, JP;
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/26 (2006.01); C22C 28/00 (2006.01);
U.S. Cl.
CPC ...
B23K 35/26 (2013.01); C22C 28/00 (2013.01);
Abstract
A lead-free solder contains 93.0 mass % or more and 98.95 mass % or less of indium, 1.0 mass % or more and 4.0 mass % or less of tin, and an addition metal. The addition metal contains at least one of silver, antimony, copper, or nickel. The addition metal is neither indium nor tin. The total of mass percentage of the addition metal is 0.05 mass % or more and 6.0 mass % or less. The sum of the total mass percentage of the addition metal, the mass percentage of indium, and the mass percentage of tin is 100 mass % or less.