Fukui, Japan

Tomohiro Mitani

USPTO Granted Patents = 10 

 

Average Co-Inventor Count = 2.3

ph-index = 3

Forward Citations = 50(Granted Patents)


Location History:

  • Takefu, JP (2007)
  • Fukui, JP (2007 - 2018)

Company Filing History:


Years Active: 2007-2018

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10 patents (USPTO):Explore Patents

Title: Tomohiro Mitani: Innovator in Semiconductor Package Technology

Introduction

Tomohiro Mitani, a prominent inventor based in Fukui, Japan, has made significant contributions to the field of semiconductor technology. With a remarkable portfolio of 10 patents, Mitani's innovations focus on improving the efficiency and performance of semiconductor packages and inertial sensors.

Latest Patents

Among his latest inventions is a unique package design that includes a semiconductor element housed within a case. This case features an opening occluded by a rectangular lid, which is ingeniously designed to include a bent portion that enhances the structural integrity and performance of the package. Another notable patent is an inertial force sensor, which integrates an oscillating-type angular velocity sensing element with an IC for signal processing. This design also incorporates a vibration isolator, demonstrating Mitani's commitment to advancing the technology of inertial sensors.

Career Highlights

Throughout his career, Mitani has worked with reputable companies such as Panasonic Corporation and Panasonic Intellectual Property Management Co., Ltd. His experiences in these organizations have equipped him with the skills and knowledge necessary to drive innovation in the semiconductor industry.

Collaborations

Mitani has collaborated with esteemed colleagues, including Hideo Ohkoshi and Takashi Uchida. Their combined expertise has likely contributed to the successful development of Mitani's groundbreaking technologies.

Conclusion

In summary, Tomohiro Mitani is a notable inventor whose work in semiconductor packaging and inertial sensors has had a lasting impact on the industry. With numerous patents to his name and valuable collaborations, his innovations promise to shape the future of technology.

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