Tomohiro Koda

Title: Tomohiro Koda: Innovator in Thermosetting Resin Technology

Introduction

Tomohiro Koda is a prominent inventor based in Otsu, Japan. He has made significant contributions to the field of thermosetting resin technology, holding a total of 4 patents. His work focuses on developing advanced materials that enhance the performance and reliability of electronic components.

Latest Patents

Koda's latest patents include a thermosetting resin composition and a flexible printed board with a cured film. The thermosetting resin composition comprises an epoxy resin, a curing accelerator, a compound with a (meth)acryloyl group, and a compound with an acidic functional group, boasting a weight average molecular weight of 1000 or more. This innovative composition may also incorporate a phosphorus-based flame retardant and organic spherical beads. Notably, it is designed to be free from photopolymerization and thermal polymerization initiators. Additionally, Koda has developed a production method for a polyimide with a black resin cured film, which involves curing a black resin composition on the polyimide using a specific spray impact technique.

Career Highlights

Koda is currently employed at Kaneka Corporation, where he continues to push the boundaries of material science. His expertise in thermosetting resins has positioned him as a key player in the development of flexible printed wiring boards, which are essential for modern electronic devices.

Collaborations

Throughout his career, Koda has collaborated with notable colleagues, including Tetsuya Kogiso and Masayoshi Kido. These partnerships have fostered innovation and have contributed to the successful development of new technologies in the field.

Conclusion

Tomohiro Koda's work in thermosetting resin technology exemplifies the impact of innovative thinking in material science. His patents and contributions continue to shape the future of electronic components, demonstrating the importance of research and development in this field.