Owego, NY, United States of America

Tom Wayson

This inventor holds 2 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 2001-2002.


% Patents Active = 50.0

Average Co-Inventor Count = 6.0

ph-index = 2

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2001-2002

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2 patents (USPTO):Explore Patents

Title: Innovations by Tom Wayson

Introduction

Tom Wayson is an accomplished inventor based in Owego, NY (US). He has made significant contributions to the field of multi-layer ceramic substrates, holding a total of 2 patents. His work focuses on enhancing the reliability of conductive line features, which is crucial for various electronic applications.

Latest Patents

Wayson’s latest patents include a method for forming conductive line features that minimize the formation of cracks at junctions between conductive vias and conductive lines. This innovative method involves providing a transition zone connected between a base section of the line and a cap. The transition zone is designed to deliver a greater volume of conductive paste during the screen printing operation than the base section directly connected to the cap. This design effectively prevents necking of the conductive line into the via, especially when the mask is misaligned within expected alignment tolerances. The transition zone may feature a jogged end or a flared end, enhancing the structural integrity of line-to-via connections.

Career Highlights

Tom Wayson is currently employed at International Business Machines Corporation (IBM), where he continues to develop innovative solutions in the field of electronics. His expertise in conductive line features has positioned him as a valuable asset to his team and the company.

Collaborations

Wayson has collaborated with notable coworkers, including John Joseph Garant and Jeffrey A Brody. Their combined efforts contribute to the advancement of technology in their field.

Conclusion

Tom Wayson is a prominent inventor whose work on conductive line features has significantly impacted the reliability of multi-layer ceramic substrates. His innovative methods and collaboration with talented colleagues at IBM continue to drive advancements in electronic technology.

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