Ichinomiya, Japan

Tohru Kuniyoshi

This inventor holds 1 USPTO granted patent. Top assignee: Toyoda Gosei Co., Ltd.. Active years: 1983.


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 1983

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1 patent (USPTO):Explore Patents

Title: Tohru Kuniyoshi: Innovator in Packing Assembly Technology

Introduction

Tohru Kuniyoshi is a notable inventor based in Ichinomiya, Japan. He has made significant contributions to the field of packing assembly technology, particularly with his innovative designs that enhance the efficiency and longevity of mechanical seals.

Latest Patents

Kuniyoshi holds a patent for a unique packing assembly designed for sealing between the cylinder head and the cylinder body. This invention features a semicircular packing that comprises both a metallic portion and an elastic portion. The design effectively seals the pierced hole of the cylinder head during installation. The packing has thick portions at both ends and a thin portion in between, allowing it to conform easily to the curved surface of the pierced hole. This innovation eliminates the need for sealing liquid and enables a smaller clamping torque while maintaining a reliable sealing state over an extended period without premature aging. He has 1 patent to his name.

Career Highlights

Kuniyoshi is currently employed at Toyoda Gosei Co., Ltd., a company known for its advancements in automotive components and materials. His work has contributed to the company's reputation for innovation and quality in the industry.

Collaborations

Throughout his career, Kuniyoshi has collaborated with talented individuals such as Mikio Ukai and Tomoyoshi Yamada. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Tohru Kuniyoshi's contributions to packing assembly technology exemplify the spirit of innovation. His work not only enhances mechanical efficiency but also sets a standard for future developments in the field.

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