Stuttgart, Germany

Tobias Boeser

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Robert Bosch. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tobias Boeser. Retrieved from https://idiyas.com/inventor/tobias-boeser

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0


Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: The Innovations of Tobias Boeser

Introduction

Tobias Boeser is a notable inventor based in Stuttgart, Germany. He has made significant contributions to the field of microelectromechanical systems (MEMS). His work focuses on developing advanced sensors that have applications in various industries.

Latest Patents

Tobias Boeser holds a patent for a microelectromechanical inertial sensor. This innovative device includes a substrate and an electromechanical structure situated on the substrate. His patent represents a step forward in sensor technology, enhancing the precision and reliability of inertial measurements.

Career Highlights

Tobias Boeser is currently employed at Robert Bosch, a leading global supplier of technology and services. His role at the company allows him to work on cutting-edge projects that push the boundaries of engineering and technology. With a focus on innovation, he has contributed to the development of products that improve everyday life.

Collaborations

Throughout his career, Tobias has collaborated with talented individuals such as Stefan Kiesel and Alice Lanniel. These partnerships have fostered a creative environment that encourages the exchange of ideas and expertise.

Conclusion

Tobias Boeser is a prominent figure in the field of microelectromechanical systems, with a patent that showcases his innovative spirit. His work at Robert Bosch and collaborations with other professionals highlight his commitment to advancing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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