Hangzhou, China

Tiwei Bie

This inventor holds 1 USPTO granted patent. Top assignee: Alipay (Hangzhou) Information Technology Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tiwei Bie. Retrieved from https://idiyas.com/inventor/tiwei-bie-35j6n1bn

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Tiwei Bie: Innovator in Container Kernel Technology

Introduction

Tiwei Bie is a notable inventor based in Hangzhou, China. He has made significant contributions to the field of technology, particularly in the area of container kernel development. His innovative work has led to the creation of a patent that enhances the functionality of container systems.

Latest Patents

Tiwei Bie holds a patent titled "Container Kernel Upgrade Methods and Apparatuses Based on Programmable Container Kernel." This patent represents a significant advancement in the way container technology can be upgraded and managed, showcasing his expertise in this specialized field. He has 1 patent to his name.

Career Highlights

Tiwei Bie is currently employed at Alipay (Hangzhou) Information Technology Co., Ltd. His role at the company allows him to apply his innovative ideas and contribute to the development of cutting-edge technology solutions. His work is instrumental in enhancing the efficiency and capabilities of container systems.

Collaborations

Throughout his career, Tiwei has collaborated with talented individuals such as Yong He and Jianfeng Tan. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Tiwei Bie is a prominent figure in the realm of container technology, with a focus on developing methods that improve system performance. His contributions are paving the way for future advancements in this field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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