Tirunelveli Subramanian Sriram

Title: Innovations of Tirunelveli Subramanian Sriram

Introduction

Tirunelveli Subramanian Sriram is an accomplished inventor based in Maynard, MA, USA. He holds two patents that showcase his expertise in the field of technology and engineering. His innovative contributions have made a significant impact in various industries.

Latest Patents

One of his latest patents is for an electromigration-resistant via structure. This method describes the formation of an electromigration-resistant intermetallic region beneath and adjacent to a conductive plug in a via. The intermetallic region is preferably made of a sintered compound of aluminum and titanium, while the conductive plug is formed of tungsten. Another notable patent is for a scanning force microscope thermal microprobe. This device is a small bimetallic thermocouple probe designed for use in scanning atomic force microscopy. It is mass-produced by etching and oxidatively sharpening silicon points on a standard silicon wafer, allowing for the inexpensive manufacturing of numerous tiny, low thermal mass probes.

Career Highlights

Throughout his career, Sriram has worked with prominent companies such as Compaq Computer Corporation and Digital Equipment Corporation. His experience in these organizations has contributed to his development as an inventor and innovator in the technology sector.

Collaborations

Sriram has collaborated with notable coworkers, including Ann C. Westerheim and John J. Maziarz. These collaborations have likely enriched his work and contributed to his innovative projects.

Conclusion

Tirunelveli Subramanian Sriram is a distinguished inventor whose patents reflect his innovative spirit and technical expertise. His contributions to electromigration-resistant structures and thermal microprobes demonstrate his commitment to advancing technology.