This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Texas Instruments Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Innovations by Inventor Tingting Yu
Introduction
Tingting Yu is a notable inventor based in Chengdu, China. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique patent that enhances the functionality of semiconductor devices.
Latest Patents
Tingting Yu holds a patent for "Ball bonding for semiconductor devices." This patent describes a semiconductor device that includes a semiconductor die with a bond pad on its surface. The invention features a ball bond with a flattened-disk shape, which is coupled to the bond pad. A channel extends into the proximal surface surrounding a central portion, allowing for improved connectivity and performance in semiconductor applications. He has 1 patent to his name.
Career Highlights
Tingting Yu is currently employed at Texas Instruments Corporation, a leading company in the semiconductor industry. His work at Texas Instruments has allowed him to apply his innovative ideas in a practical setting, contributing to the advancement of technology in this field.
Collaborations
Tingting has collaborated with talented coworkers such as Zi Qi Wang and Ye Zhuang. Their teamwork has fostered an environment of innovation and creativity, leading to advancements in semiconductor technology.
Conclusion
Tingting Yu's contributions to the semiconductor industry through his patent and work at Texas Instruments Corporation highlight his role as an influential inventor. His innovative spirit continues to drive advancements in technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile