Tingting Wang

Title: Innovations by Tingting Wang in Integrated Device Technology

Introduction

Tingting Wang is a prominent inventor based in Hong Kong, CN. She has made significant contributions to the field of integrated devices, particularly through her innovative patent. With a focus on enhancing device functionality, her work has implications for various electronic applications.

Latest Patents

Tingting Wang holds a patent titled "Multiple surface integrated devices on low resistivity substrates." This invention relates to a device that incorporates portions on multiple substrate surfaces. The device features a low resistivity substrate with first and second surfaces, where an electrically-conductive component is placed on the first surface. An intermediate electrically-insulating layer may be included between the conductive component and the substrate. Additionally, a second electrically-conductive component is positioned on the second surface. The design includes a cavity filled with high resistivity material, creating electrically-conducting pathways that connect the two components. This technology can be utilized in various devices, including inductors, capacitors, and antennas.

Career Highlights

Tingting Wang is associated with the Hong Kong Applied Science and Technology Research Institute Company, Limited. Her work at this institution has allowed her to explore advanced technologies and contribute to the development of innovative solutions in the field of electronics.

Collaborations

Tingting collaborates with talented individuals such as Ruonan Wang and Yan Liu. These partnerships enhance her research and development efforts, fostering a collaborative environment that drives innovation.

Conclusion

Tingting Wang's contributions to integrated device technology exemplify her commitment to innovation. Her patent on multiple surface integrated devices showcases her expertise and potential impact on the electronics industry.