Beijing, China

Tingqiao Wu

This inventor holds 1 USPTO granted patent. Top assignee: New H3C Technologies Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tingqiao Wu. Retrieved from https://idiyas.com/inventor/tingqiao-wu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Tingqiao Wu and Secure SRv6 Packet Forwarding.

Introduction

Tingqiao Wu is an inventor based in Beijing, China, associated with New H3C Technologies Co., Ltd. His patent work includes a method and apparatus for packet forwarding in SRv6 networks.

Latest Patents

Wu is named on one patent: “Packet Forwarding Methods and Apparatuses.” The application describes a headend sending source path routing information and a source path control probe packet to other nodes along an SRv6 TE Policy path. This prompts those nodes to create a source path control table containing forwarding information that they might otherwise not track. The table is intended to mitigate risks arising from that missing information and improve SRv6 network security. Wu is associated with 1 patent.

Career Highlights

Wu’s documented patent contribution focuses on network routing and security. The described approach aims to improve how nodes along an SRv6 TE Policy path handle relevant forwarding information.

Collaborations

The patent information associates Wu with New H3C Technologies Co., Ltd. The provided details do not identify additional collaborators.

Conclusion

Tingqiao Wu’s patent contribution addresses a specific security challenge in SRv6 packet forwarding by helping path nodes maintain relevant routing information.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…