Beijing, China

Tinghui Chen


Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):

Title: Innovations by Inventor Tinghui Chen in Curved-Surface Laminating Technology

Introduction

Tinghui Chen is a notable inventor based in Beijing, China, recognized for his innovative contributions to the field of curved-surface laminating technology. With a single patent to his name, Chen has made significant strides in how flexible panels are laminated with curved-surface cover plates.

Latest Patents

Tinghui Chen’s patent, titled "Curved-surface laminating device and curved-surface laminating method", showcases his ingenuity in addressing the challenges associated with lamination processes. This patent provides a device that includes a flexible profiling jig designed to match the shape of curved cover plates. The innovative device also features a bearing film that attaches to the flexible panel and a tensioning device to ensure that the bearing film and laminating surface are properly profiled. This method enhances the efficiency and quality of lamination processes.

Career Highlights

Chen has made significant contributions while working at Chengdu BOE Optoelectronics Technology Co., Ltd. and BOE Technology Group Co., Ltd. Throughout his career, he has developed a reputation for solving complex engineering problems and enhancing manufacturing processes through innovation.

Collaborations

Throughout his professional journey, Tinghui Chen has collaborated with esteemed coworkers, including Wenwei Mo and Wei Qing. These collaborations have fostered a creative environment conducive to innovation and have played a pivotal role in advancing curved-surface laminating technologies.

Conclusion

Tinghui Chen's work exemplifies the innovative spirit of modern inventors in the realm of manufacturing technologies. His patent on curved-surface laminating devices not only signifies a technical breakthrough but also highlights the importance of collaboration in fostering advancements within the industry. As technology evolves, Chen's contributions will undoubtedly pave the way for future innovations.

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