Ting-Yang Chou

Title: Ting-Yang Chou: Innovator in Electronic Packaging

Introduction

Ting-Yang Chou is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, showcasing his expertise through innovative designs and manufacturing methods.

Latest Patents

Ting-Yang Chou holds a patent for an electronic package and its manufacturing method. This invention involves forming a plurality of conductive pillars and placing an electronic element on a first circuit structure. The process includes covering the conductive pillars and the electronic element with a cladding layer, followed by the formation of a second circuit structure on the cladding layer. This design ensures that the conductive pillars are electrically connected to both the first and second circuit structures, while the electronic element is connected to the first circuit structure. Notably, a fan-out redistribution layer is configured within both circuit structures, and at least one ground layer is included in the second circuit structure. The ground layer consists of multiple sheet bodies arranged in an array, with slots positioned between adjacent sheet bodies.

Career Highlights

Ting-Yang Chou is currently employed at Siliconware Precision Industries Co., Ltd., where he continues to develop innovative solutions in electronic packaging. His work has been instrumental in advancing the technology used in electronic devices.

Collaborations

Ting-Yang Chou has collaborated with esteemed colleagues such as Yih-Jenn Jiang and Don-Son Jiang. Their combined expertise has contributed to the success of various projects within the company.

Conclusion

Ting-Yang Chou is a prominent figure in the field of electronic packaging, with a patent that reflects his innovative approach to manufacturing methods. His contributions continue to influence the industry and pave the way for future advancements.