Ting-Wei Lin

Title: Ting-Wei Lin: Innovator in Antenna Technology

Introduction

Ting-Wei Lin is a prominent inventor based in Tainan, Taiwan. He has made significant contributions to the field of antenna technology, holding a total of 3 patents. His innovative designs focus on enhancing communication systems through advanced antenna modules.

Latest Patents

One of Ting-Wei Lin's latest patents is the "Dual-band patch array antenna module and electronic device using the same." This invention features a dual-band patch array antenna module that includes an insulative carrier substrate, a common conductive metal layer, a common grounding metal layer, an outer surrounding shielding structure, and multiple antenna structures for different frequency bands. This design aims to improve the efficiency and performance of electronic devices utilizing this technology.

Another notable patent is the "Movable device and block-type millimeter wave array antenna module." This invention comprises an antenna carrying substrate with various block-shaped carrier bodies, which house both signal transmitting and receiving antenna structures. The design also includes dummy antenna groups to enhance the overall functionality of the module.

Career Highlights

Ting-Wei Lin has worked with Taiwan Inpaq Electronic Co., Ltd., where he has applied his expertise in antenna technology. His work has contributed to the development of advanced communication systems, showcasing his commitment to innovation in the field.

Collaborations

Throughout his career, Ting-Wei Lin has collaborated with notable colleagues such as Ta-Fu Cheng and Cheng-Yi Wang. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Ting-Wei Lin is a distinguished inventor whose work in antenna technology has made a significant impact on communication systems. His innovative patents reflect his dedication to advancing technology and improving electronic devices.