This inventor holds 1 USPTO granted patent. Top assignee: Actron Technology Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Innovations by Ting-Ling Chen in Power Semiconductor Technology.
Introduction
Ting-Ling Chen is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of power semiconductor technology. His innovative work has led to the development of a unique semiconductor package signal connection component.
Latest Patents
Ting-Ling Chen holds 1 patent for his invention titled "Power semiconductor package signal connection component and semiconductor module." This invention features a cylinder with a first through hole and two bases on opposite sides. Each base includes a continuous protrusion pattern and has a flat surface, a curved surface, and a second through hole. The design allows for efficient signal connection in power semiconductor applications.
Career Highlights
Ting-Ling Chen is currently associated with Actron Technology Corporation, where he continues to innovate in the semiconductor industry. His work focuses on enhancing the performance and reliability of semiconductor devices.
Conclusion
Ting-Ling Chen's contributions to power semiconductor technology exemplify the importance of innovation in modern electronics. His patent reflects a commitment to advancing the field and improving device functionality.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile