Chu-Pei, Taiwan

Ting-Hsin Kuo

USPTO Granted Patents = 3 

Average Co-Inventor Count = 4.9

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2017-2019

Loading Chart...
3 patents (USPTO):Explore Patents

Title: Innovations by Inventor Ting-Hsin Kuo

Introduction

Ting-Hsin Kuo is a notable inventor based in Chu-Pei, Taiwan. He has made significant contributions to the field of probe technology, holding a total of 3 patents. His work focuses on enhancing the functionality and efficiency of probe devices used in various applications.

Latest Patents

Ting-Hsin Kuo's latest patents include innovative designs for spring probes and probe cards. One of his patents describes a probe card that features a probe seat with upper and lower dies, a probe accommodating hole, and a spring probe that includes a spring sleeve with non-spring sections. This design allows for improved contact with circuit boards, enhancing the reliability of electronic testing. Another patent outlines a probe device that incorporates a spring probe with a connection segment fixed to a needle. This design prevents excessive deflection and bending, ensuring the probe can withstand external forces during operation.

Career Highlights

Kuo's career at Mpi Corporation has been marked by his dedication to advancing probe technology. His innovative designs have contributed to the company's reputation as a leader in the field. His work not only showcases his technical expertise but also his commitment to improving electronic testing methods.

Collaborations

Ting-Hsin Kuo has collaborated with talented coworkers such as Tsung-Yi Chen and Chien-Chou Wu. Their combined efforts have led to the development of cutting-edge technologies that push the boundaries of what is possible in probe design.

Conclusion

Ting-Hsin Kuo's contributions to probe technology through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to impact the industry positively, paving the way for future innovations.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…