Taichung, Taiwan

Ting Hsien Hsu

This inventor holds 1 USPTO granted patent. Top assignee: Merry Electronics (Shenzhen) Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ting Hsien Hsu. Retrieved from https://idiyas.com/inventor/ting-hsien-hsu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Ting Hsien Hsu and a Wireless Headphone Battery-Cover Invention.

Introduction

Ting Hsien Hsu is an inventor associated with Taichung, Taiwan. His patent work includes a wireless headphone design that combines an ear part with a movable cover for concealing and accessing the battery.

Latest Patents

The provided information lists 1 patent for Hsu: “Wireless Headphone and Hidden Cover.” The invention describes a headphone housing with a receiving space for a battery and an ear part attached to the housing. A hidden cover sits beside the ear part and includes a base connected to the housing and a movable covering member. In the open mode, the covering member slides away from the housing to expose the battery. In the closed mode, it slides into contact with the ear part and housing to shield the battery.

Career Highlights

Hsu is associated with Merry Electronics (Shenzhen) Co., Ltd. The available information identifies his work in headphone design but does not provide further details about his career or professional history.

Collaborations

Ting Chia Hsu, identified in the provided information as a woman, is listed as Hsu’s coworker. The available details do not specify her role in the patent or the invention.

Conclusion

Ting Hsien Hsu’s listed patent presents a practical headphone feature that allows a battery to be exposed for access or concealed by a sliding cover.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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