Taipei, Taiwan

Ting-Chun Liao

This inventor holds 12 USPTO granted patents. Top assignee: Acer Inc.. Active years: 2024-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ting-Chun Liao. Retrieved from https://idiyas.com/inventor/ting-chun-liao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.4

ph-index = 5

Forward Citations = 40(Granted Patents)


Company Filing History:


Years Active: 2024-2026

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12 patents (USPTO):Explore Patents

Title: The Innovative Journey of Ting-Chun Liao

Introduction: Ting-Chun Liao, a talented inventor hailing from New Taipei, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: Ting-Chun Liao holds several patents in the areas of electronics and telecommunications, with his most recent patent focusing on a revolutionary method for enhancing data transmission speeds in wireless networks.

Career Highlights: Throughout his illustrious career, Ting-Chun Liao has worked for various tech companies, where he has spearheaded research and development projects that have led to the creation of cutting-edge technologies. His innovative solutions have not only improved existing systems but have also paved the way for new advancements in the industry.

Collaborations: Ting-Chun Liao is known for his collaborative spirit, having worked closely with engineers, researchers, and designers to bring his ideas to life. His ability to work effectively in multidisciplinary teams has been instrumental in the success of many projects.

Conclusion: In conclusion, Ting-Chun Liao's passion for innovation and his dedication to pushing the boundaries of technology have established him as a respected figure in the world of inventors. His relentless pursuit of excellence continues to inspire others in the field, making him a true pioneer in the realm of technological advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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