Philadelphia, PA, United States of America

Ting-Chia Huang

This inventor holds 2 USPTO granted patents. Top assignee: Kulicke and Soffa Industries, Inc.. Active years: 2023-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ting-Chia Huang. Retrieved from https://idiyas.com/inventor/ting-chia-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 50.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2023-2026

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2 patents (USPTO):Explore Patents

Title: Innovations by Inventor Ting-Chia Huang in Die Transfer Technology

Introduction

Ting-Chia Huang, an accomplished inventor based in Philadelphia, PA, has made significant contributions to the field of die transfer technologies. With one patent to her name, Huang's work focuses on enhancing the efficiency and effectiveness of die transfer systems, which play a critical role in various manufacturing processes.

Latest Patents

The patent held by Ting-Chia Huang, titled "Reusable die catch materials, reusable die release materials, related die transfer systems, and methods of using the same," introduces a sophisticated system designed to facilitate the transfer of multiple die from a die source to a receiving substrate. This innovative system includes a die source containing several die that are attached to a carrier. A unique feature of this system is the reusable die catch material embedded in the receive substrate, which allows for the efficient receipt of the die from the source. Furthermore, the incorporation of a laser source provides the necessary energy to interact with die release materials, streamlining the transfer process and enhancing productivity.

Career Highlights

Ting-Chia Huang is currently employed at Kulicke and Soffa Industries, Inc., a company renowned for its advancements in semiconductor equipment and technology. Her role at the company has enabled her to leverage her expertise in die transfer systems, contributing to innovative solutions that benefit the broader manufacturing landscape.

Collaborations

Throughout her career, Huang has had the opportunity to work alongside esteemed colleagues such as Thomas Colosimo and Tao-Hua Lee. These collaborations have allowed her to share insights and explore new ideas, further driving innovation in their field.

Conclusion

Ting-Chia Huang’s patent and career exemplify a commitment to advancing die transfer technology. Through her work at Kulicke and Soffa Industries, Inc. and her collaborative efforts with colleagues, Huang continues to push the boundaries of innovation in the semiconductor industry, securing her place as a notable inventor in this vital sector.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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