Taichung, Taiwan

Ting Chia Hsu

This inventor holds 1 USPTO granted patent. Top assignee: Merry Electronics (Shenzhen) Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ting Chia Hsu. Retrieved from https://idiyas.com/inventor/ting-chia-hsu-yocq5any

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Ting Chia Hsu: Inventor of a Wireless Headphone with a Hidden Cover.

Introduction

Ting Chia Hsu is an inventor associated with Taichung, Taiwan. His patent work includes a wireless headphone design that combines a battery compartment with a movable cover.

Latest Patents

Hsu is credited with 1 patent: “Wireless Headphone and Hidden Cover.” The invention describes a headphone housing with a receiving space for a battery and an ear part attached to the housing. A hidden cover sits beside the ear part and includes a base connected to the housing and a movable covering member.

In the open mode, the covering member slides along the base away from the housing to expose the battery. In the closed mode, it slides toward the ear part until it contacts both the ear part and the housing, shielding the battery.

Career Highlights

Hsu is associated with Merry Electronics (Shenzhen) Co., Ltd. His patent presents a practical approach to concealing and accessing a headphone battery while integrating the cover into the area beside the ear part.

Collaborations

Hsu’s listed coworker is Ting Hsien Hsu, who is a woman. The available information identifies their association but does not specify further details about their collaboration.

Conclusion

Ting Chia Hsu’s patent focuses on a wireless headphone with a sliding hidden cover that provides access to the battery when open and shields it when closed.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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