Hong Kong, China

Timothée Lesné

This inventor holds 1 USPTO granted patent. Top assignee: Citadel Casing Ltd. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Timothée Lesné. Retrieved from https://idiyas.com/inventor/timothée-lesné-m5k7cupp

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: The Innovative Journey of Timothée Lesné

Introduction: Timothée Lesné is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of packaging through his innovative ideas and solutions. With a focus on enhancing packaging efficiency, Lesné has secured a patent that showcases his creativity and technical expertise.

Latest Patents: Timothée Lesné holds a patent related to packaging, which highlights his commitment to improving product safety and sustainability. This patent represents his innovative approach to addressing challenges in the packaging industry. He has 1 patent to his name, reflecting his dedication to advancing technology in this area.

Career Highlights: Lesné's career has been marked by his work at Citadel Casing Ltd., where he has played a crucial role in developing packaging solutions. His experience in the industry has allowed him to collaborate with other professionals and contribute to various projects that aim to enhance packaging design and functionality.

Collaborations: Timothée Lesné has worked alongside his coworker, Douglas Rumsam, to bring innovative ideas to life. Their collaboration has fostered a creative environment that encourages the development of new packaging technologies.

Conclusion: Timothée Lesné's contributions to the packaging industry through his patent and work at Citadel Casing Ltd. demonstrate his innovative spirit and commitment to excellence. His journey as an inventor continues to inspire others in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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