Acworth, GA, United States of America

Timothy W Hendricks

This inventor holds 2 USPTO granted patents and 1 published patent application, plus 2 CIPO patents and 3 EPO patents. Top assignee: Graphic Packaging International, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Timothy W Hendricks. Retrieved from https://idiyas.com/inventor/timothy-w-hendricks

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 50.0

 

 

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2026

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2 patents (USPTO):Explore Patents

Title: The Innovations of Timothy W. Hendricks

Introduction: Timothy W. Hendricks is an inventor based in Acworth, GA (US). He is currently associated with Graphic Packaging International, Inc. Although he has not yet been granted any patents, his work in the field of product packaging systems showcases his innovative spirit and dedication to advancing technology.

Latest Patent Applications: One of Timothy's notable patent applications is for a "Blank Turning Assembly, Related Systems And Methods." This application describes a method of moving a blank in a product packaging system. The method includes positioning the blank on a blank feeding assembly, which defines a first machine direction. It advances the blank from the blank feeding assembly toward a product conveyor assembly configured to move at least one product in a second machine direction, which is offset from the first machine direction. Additionally, the blank is moved along a blank turning assembly that features a plurality of turning rails following at least one of a curved path and an angled path between the blank feeding assembly and the product conveyor assembly.

Conclusion: Timothy W. Hendricks is an inventive mind contributing to the field of product packaging, and his latest patent application reflects his commitment to innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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