Timothy Titus Popp

Title: Innovations of Timothy Titus Popp

Introduction

Timothy Titus Popp is an accomplished inventor based in Knoxville, TN (US). He has made significant contributions to the field of non-planar substrates through his innovative patents. With a total of 2 patents, Popp continues to push the boundaries of technology and engineering.

Latest Patents

Popp's latest patents focus on a lamination process for producing non-planar substrates. This process involves forming a green multi-layer component with an embedded pattern of barrier material. The barrier material can be configured in either a positive pattern to create recessed areas or a negative pattern to form raised areas on the component. Peripheral channels are machined into the green laminate surface to outline each pattern feature. These channels are designed to contact and overlap the edges of the barrier material. The separation of the barrier material and the overlying layers of ceramic material results in a non-planar part with either raised or recessed areas, depending on the pattern used. Additionally, an apparatus and process to control the machining depth of cut using both AC and DC sensing techniques is disclosed. The non-planar component may also feature recessed surface metallurgy, such as seal bands and filled via connections, which can withstand planarization.

Career Highlights

Timothy Popp is currently employed at International Business Machines Corporation (IBM), where he applies his expertise in innovative technologies. His work has contributed to advancements in the field of materials science and engineering.

Collaborations

Popp has collaborated with notable coworkers, including Mark J LaPlante and David Clifford Long, to further enhance his research and development efforts.

Conclusion

Timothy Titus Popp is a notable inventor whose work in non-planar substrates has led to significant advancements in technology. His innovative patents and collaborations reflect his commitment to pushing the boundaries of engineering.