Brookfield, CT, United States of America

Timothy Copp

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Windings, Inc.. Active years: 2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Timothy Copp. Retrieved from https://idiyas.com/inventor/timothy-copp

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 43(Granted Patents)


Company Filing History:


Years Active: 2007

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1 patent (USPTO):Explore Patents

Title: The Innovations of Timothy Copp

Introduction

Timothy Copp is an accomplished inventor based in Brookfield, CT (US). He has made significant contributions to the field of consumer packaging, particularly with his innovative approach to wire packaging solutions. His work has garnered attention for its practicality and efficiency.

Latest Patents

Timothy holds a patent for the Reel-less REELEX wire consumer package. This invention addresses common issues associated with traditional wire packaging, providing a more user-friendly experience for consumers. The patent showcases his ability to think creatively and solve real-world problems.

Career Highlights

Timothy is currently employed at Windings, Inc., where he continues to develop innovative solutions in the packaging industry. His role at the company allows him to apply his expertise and contribute to the advancement of packaging technologies.

Collaborations

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Conclusion

Timothy Copp's contributions to the field of consumer packaging, particularly through his patent for the Reel-less REELEX wire consumer package, highlight his innovative spirit and dedication to improving everyday products. His work at Windings, Inc. further emphasizes his commitment to advancing packaging solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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