Company Filing History:
Years Active: 2002-2003
Title: Tim Teoh: Innovator in Semiconductor Packaging
Introduction
Tim Teoh is a notable inventor based in Singapore, SG. He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His work focuses on improving the moldability of packaged devices, which is crucial for the efficiency and reliability of electronic components.
Latest Patents
Tim's latest patents include innovative designs for U-shape tape used in BOC FBGA packages. These patents describe an FBGA packaged device that features a die adhered to a substrate, with a small gap formed between them. An opening is created through the substrate adjacent to the center portion of the die. An encapsulating mold is formed around the die, extending into the gap and filling the channel. Additionally, at least one barrier is positioned in the gap between the substrate and the die, adjacent to the channel, to control the flow path of the encapsulating material during the mold formation process.
Career Highlights
Tim Teoh is currently employed at Micron Technology Incorporated, where he continues to develop innovative solutions in semiconductor technology. His expertise in moldability improvements has positioned him as a key player in the industry.
Collaborations
Tim has collaborated with notable coworkers, including Lim Thiam Chye and Lee Choon Kuan, contributing to various projects that enhance the performance and reliability of semiconductor devices.
Conclusion
Tim Teoh's contributions to semiconductor packaging through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to impact the efficiency of electronic components, showcasing the importance of innovation in technology.