Munich, Germany

Tim Sievers

This inventor holds 1 USPTO granted patent. Top assignee: Eos Gmbh Electro Optical Systems. Active years: 1999.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tim Sievers. Retrieved from https://idiyas.com/inventor/tim-sievers-1q24q8gl

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 120(Granted Patents)


Company Filing History:


Years Active: 1999

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1 patent (USPTO):Explore Patents

Title: Tim Sievers - Innovator in 3D Printing Technology

Introduction

Tim Sievers is a notable inventor based in Munich, Germany. He has made significant contributions to the field of 3D printing technology. His innovative work focuses on the production of three-dimensional objects using advanced techniques.

Latest Patents

Tim Sievers holds a patent for an "Apparatus for producing a three-dimensional object by laser sintering." This patent showcases his expertise in utilizing laser technology to create complex structures in a precise manner. He has 1 patent to his name, reflecting his commitment to advancing the field.

Career Highlights

Tim Sievers is currently employed at EOS GmbH Electro Optical Systems, a leading company in the 3D printing industry. His role at EOS allows him to work on cutting-edge projects that push the boundaries of additive manufacturing. His contributions have been instrumental in enhancing the capabilities of 3D printing technologies.

Collaborations

Tim collaborates with Christian Wilkening, a fellow innovator in the field. Their partnership fosters a creative environment that encourages the development of new ideas and technologies.

Conclusion

Tim Sievers is a prominent figure in the realm of 3D printing, with a focus on laser sintering technology. His work at EOS GmbH and his innovative patent highlight his dedication to advancing manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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