Tim Jones

Title: Tim Jones - Innovator in Semiconductor Packaging

Introduction

Tim Jones is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His work focuses on improving the efficiency and functionality of semiconductor devices.

Latest Patents

Among his latest patents is the "Low-profile ball-grid array semiconductor package and method." This innovative design features a ball-grid array (BGA) semiconductor package that includes a substrate attached to a support substrate. The substrate has an opening extending from the upper surface to the lower surface, allowing for the attachment of an integrated circuit chip within the opening. Bond pads on the chip are electrically connected to ball pads on the lower surface of the substrate, with conductive solder balls attached to these pads. The support substrate provides a low profile and acts as a standoff, limiting the collapse of the solder balls when the package is attached to an application board.

Career Highlights

Tim Jones is currently employed at Motorola Corporation, where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing the technology used in electronic devices.

Collaborations

Some of his coworkers include Denise M Ommen and John Baird, who contribute to the collaborative environment at Motorola Corporation.

Conclusion

Tim Jones is a prominent figure in the semiconductor packaging industry, with a focus on developing innovative solutions that enhance device performance. His contributions are shaping the future of technology in significant ways.