Tim Hing Lai

Title: Tim Hing Lai: Innovator in Wafer Inspection Technology

Introduction

Tim Hing Lai is a notable inventor based in Singapore, recognized for his contributions to the field of semiconductor technology. He holds a patent that showcases his innovative approach to wafer inspection systems, which are crucial in the manufacturing of semiconductors.

Latest Patents

Tim Hing Lai's patent, titled "Systems and methods for automatically verifying correct die removal from film frames," introduces a skeleton wafer inspection system. This system features an expansion table that is displaceable relative to a camera, which captures segmental images of a skeleton wafer on a film frame. During the image capture process, illumination is directed to both the top and bottom of the film frame. The segmental images are digitally stitched together to create a composite image, which can be analyzed to identify the presence or absence of die at specific positions. This technology not only aids in die sort operations but also verifies the accuracy of die detection prior to sorting.

Career Highlights

Throughout his career, Tim Hing Lai has worked with prominent companies in the semiconductor industry, including Asti Holdings Limited and Semiconductor Technologies & Instruments Pte. Ltd. His experience in these organizations has contributed significantly to his expertise in wafer inspection technologies.

Collaborations

Tim has collaborated with talented individuals such as Ajharali Amanullah and Jing Lin, who have contributed to his projects and innovations in the field.

Conclusion

Tim Hing Lai's innovative work in wafer inspection technology exemplifies the importance of advancements in the semiconductor industry. His patent reflects a significant step forward in ensuring the accuracy and efficiency of die removal processes.