The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 03, 2018

Filed:

Jun. 06, 2014
Applicant:

Asti Holdings Limited, Singapore, SG;

Inventors:

Ajharali Amanullah, Singapore, SG;

Tim Hing Lai, Singapore, SG;

Jing Lin, Singapore, SG;

Lian Seng Ng, Singapore, SG;

Soon Guan Tan, Singapore, SG;

Assignee:

Asti Holdings Limited, Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 9/47 (2006.01); H04N 17/00 (2006.01); H04N 7/18 (2006.01); G06T 7/00 (2017.01); H01L 21/67 (2006.01); G06K 9/46 (2006.01); G06T 11/60 (2006.01); H04N 5/225 (2006.01); G06T 7/33 (2017.01); G06T 7/73 (2017.01); G06T 7/13 (2017.01); H04N 17/02 (2006.01);
U.S. Cl.
CPC ...
G06T 7/001 (2013.01); G06K 9/4604 (2013.01); G06K 9/4661 (2013.01); G06T 7/0008 (2013.01); G06T 7/13 (2017.01); G06T 7/337 (2017.01); G06T 7/74 (2017.01); G06T 11/60 (2013.01); H01L 21/67259 (2013.01); H01L 21/67271 (2013.01); H04N 5/2256 (2013.01); G06T 2207/20221 (2013.01); G06T 2207/30148 (2013.01);
Abstract

A skeleton wafer inspection system includes an expansion table displaceable relative to a camera configured for capturing segmental images of a skeleton wafer on a film frame. During segmental image capture, illumination is directed to the top and/or bottom of the film frame. Segmental images are digitally stitched together to produce a composite image, which can be processed to identify die presence or absence therein at active area die positions having counterpart die positions in a process wafer map. A composite image of a diced wafer on a film frame can also be generated, and used as a navigation aid or guide during die sort operations, or to verify whether a die sort apparatus has correctly detected a reference die prior to die sort operations. A composite image of a skeleton wafer can similarly be generated for use as a navigation aid or guide for film frame repopulation operations.


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