Company Filing History:
Years Active: 2001
Title: The Innovative Contributions of Tim Dyer
Introduction
Tim Dyer is a notable inventor based in Tempe, AZ (US). He has made significant contributions to the field of chemical mechanical polishing, particularly through his innovative patent. His work has implications for the semiconductor industry, where precision and efficiency are paramount.
Latest Patents
Tim Dyer holds a patent titled "Method for chemical mechanical polishing using synergistic geometric patterns." This patent describes a method for planarizing the surface of a wafer against a polishing pad. The process involves securing the wafer in a carrier, pressing it against the polishing pad, rotating both the wafer and pad, and moving the wafer across the pad to create geometric patterns. Notably, the geometric patterns include a 'figure eight', an elliptical pattern, and a peanut-shaped pattern. In one embodiment, both a 'figure eight' pattern and an elliptical pattern are utilized during a single planarizing operation. The method employs Bezier splines to create these geometric patterns, which optimizes data storage and transfer for programmable wafer carriers.
Career Highlights
Tim Dyer is associated with Speedfam-IPEC Corporation, where he has been able to apply his innovative ideas in a practical setting. His work has contributed to advancements in wafer processing technology, enhancing the efficiency and effectiveness of chemical mechanical polishing techniques.
Collaborations
Throughout his career, Tim has collaborated with notable colleagues such as Mike L. Bowman and Gene Hempel. These collaborations have likely fostered an environment of innovation and shared expertise, further enhancing the impact of their collective work.
Conclusion
Tim Dyer's contributions to the field of chemical mechanical polishing through his innovative patent demonstrate his commitment to advancing technology in the semiconductor industry. His work not only showcases his inventive spirit but also highlights the importance of collaboration in driving innovation forward.