Mora, MN, United States of America

Tim Bliss

This inventor holds 1 USPTO granted patent. Top assignee: Cortec Corporation. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tim Bliss. Retrieved from https://idiyas.com/inventor/tim-bliss

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Tim Bliss: Innovator in Biodegradable Film Technology

Introduction

Tim Bliss is an accomplished inventor based in Mora, MN (US). He has made significant contributions to the field of biodegradable materials, particularly through his innovative patent related to tensioning films. His work focuses on creating environmentally friendly solutions that address the growing concerns of plastic waste.

Latest Patents

Tim Bliss holds a patent for a "Biodegradable tensioning film and fabrication processes for making same." This invention features a multilayer co-extruded film that includes an inner layer designed to be oriented toward the object being wrapped, an outer layer positioned away from the object, and at least one core layer situated between them. The film is primarily composed of biodegradable and compostable polymeric materials, making it a sustainable alternative to traditional plastic films.

Career Highlights

Tim is currently employed at Cortec Corporation, where he continues to develop innovative solutions in the field of biodegradable materials. His dedication to sustainability and innovation has positioned him as a key player in the industry.

Collaborations

Tim has collaborated with notable colleagues such as Boris A Miksic and Caleb Pheneger, contributing to the advancement of biodegradable technologies.

Conclusion

Tim Bliss exemplifies the spirit of innovation in the realm of biodegradable materials. His work not only addresses environmental challenges but also paves the way for future advancements in sustainable packaging solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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