Location History:
- Krefeld, DE (1999)
- Duisburg, DE (2002)
Company Filing History:
Years Active: 1999-2002
Title: Tilman Schwinn: Innovator in Soldering Technology
Introduction
Tilman Schwinn is a notable inventor based in Duisburg, Germany. He has made significant contributions to the field of soldering technology, holding 2 patents that showcase his innovative approach to improving soldering processes for printed circuit boards.
Latest Patents
One of his latest patents is a soldering device designed to create a protective-gas atmosphere for soldering printed circuit boards. This apparatus features a solder container and a casing that facilitates the transport of circuit boards through a solder wave. The modular design of the casing includes various subassemblies, such as an input tunnel and an outlet tunnel, which enhance its functionality.
Another significant patent involves a method and device for mechanically removing solder beads from the surface of printed circuit boards. This invention ensures that solder beads are removed without damaging the boards by utilizing a jet of cold gas directed at the surface immediately after the soldering process.
Career Highlights
Tilman Schwinn has worked with prominent companies in the industry, including Messer Griesheim GmbH. His experience in these organizations has contributed to his expertise in soldering technology and innovation.
Collaborations
Throughout his career, Schwinn has collaborated with notable professionals such as Heinz-Olaf Lucht and Jens Tauchmann. These partnerships have likely influenced his work and contributed to his success as an inventor.
Conclusion
Tilman Schwinn's contributions to soldering technology through his patents and career experiences highlight his role as an innovator in the field. His work continues to impact the industry positively.