The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 15, 1999

Filed:

Jul. 25, 1997
Applicant:
Inventors:

Jens Tauchmann, Berlin, DE;

Tilman Schwinn, Krefeld, DE;

Heinz-Olaf Lucht, Krefeld, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
228125 ; 228264 ; 228 201 ; 228 205 ; 228 19 ; 228199 ; 228200 ; 228201 ;
Abstract

The invention relates to a method for mechanically removing solder beads (14) from the surface of printed circuit boards (10) directly after they pass through the solder flow during flow soldering of printed circuit boards in a soldering plant. In order to ensure that the solder beads are mechanically removed without damaging the printed circuit boards, the solder beads (14) are mechanically removed by means of at least one jet (50) of cold gas directed onto the surface.


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