Friedrichsdorf, Germany

Till Franke

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Novell, Inc.. Active years: 2011.

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2011

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1 patent (USPTO):Explore Patents

Title: The Innovative Mind of Till Franke

Introduction

Till Franke is a notable inventor based in Friedrichsdorf, Germany. He has made significant contributions to the field of data center efficiency through his innovative patent. His work focuses on improving thermal management in computing environments, which is crucial for optimizing performance and energy consumption.

Latest Patents

Till Franke holds a patent for a method titled "Dynamic thermal load balancing." This invention aims to enhance thermal efficiency in data centers by measuring temperatures at computing devices. If the temperature exceeds a predetermined threshold, the method facilitates the migration of computing workloads to alternate devices. This process helps maintain optimal operating temperatures, thereby improving overall system performance. The patent also includes provisions for a data orchestrator that manages temperature data and workload distribution.

Career Highlights

Franke is currently associated with Novell, Inc., where he applies his expertise in technology and innovation. His work at Novell has allowed him to explore various aspects of data management and efficiency, contributing to the company's reputation as a leader in software solutions.

Collaborations

One of his notable collaborators is Adam Spiers. Together, they have worked on projects that leverage their combined knowledge and skills in technology and innovation.

Conclusion

Till Franke's contributions to the field of data center efficiency through his patent on dynamic thermal load balancing exemplify his innovative spirit. His work not only addresses critical challenges in computing environments but also sets the stage for future advancements in thermal management.

Profile summary based on public USPTO records.
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