Tien-Lou Ho

Title: Tien-Lou Ho: Innovator in Wire Bonding Technology

Introduction

Tien-Lou Ho is a prominent inventor based in Taichung Hsien, Taiwan. He has made significant contributions to the field of semiconductor packaging through his innovative designs and methodologies. His work focuses on improving the efficiency and reliability of wire bonding processes.

Latest Patents

Tien-Lou Ho holds a patent for a method titled "Profile design for wire bonding." This invention provides a novel approach to simulate the forces acting on a bonding wire in semiconductor packages. The method utilizes a combination of linkages with springs to form the bonding wire profile. By determining the coefficients of elasticity and plasticity of the springs based on the bending angle of the linkages, the design effectively simulates the elastic-plastic deformation of the wires. This operational model simplifies the analysis of the profile and forces on fine wires, ultimately preventing necking and fracture during the formation process. The innovative design aims to achieve optimal wire bonding profiles, enhancing the overall performance of semiconductor packages.

Career Highlights

Tien-Lou Ho is affiliated with the Industrial Technology Research Institute, where he continues to advance research in semiconductor technologies. His expertise in wire bonding has positioned him as a key figure in the industry, contributing to the development of more efficient manufacturing processes.

Collaborations

He has collaborated with notable colleagues, including Yu-Lung Lo and Jau-Liang Chen, to further enhance the research and development efforts in their field.

Conclusion

Tien-Lou Ho's innovative work in wire bonding technology exemplifies the importance of research and development in the semiconductor industry. His contributions not only improve manufacturing processes but also pave the way for future advancements in technology.