The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2001
Filed:
Mar. 11, 1998
Yu-Lung Lo, Taipei, TW;
Tien-Lou Ho, Taichung Hsien, TW;
Jau-Liang Chen, Taichung, TW;
Sheng-Lung Wu, Taoyuan Hsien, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
A method of linkage with springs mold is provided to simulate the condition of forces acting on a bonding wire for semiconductor package. The bonding wire profile can be formed by means of combining several sets of linkage with springs, wherein the coefficients of elasticity and plasticity of the springs are determined by the bending angle of two linkages which simulates the elastic-plastic deformation of the wires. The operational model can be simplified and the time can be saved by using the multiple degrees of freedom of the links/springs to analyze the profile and forces on the fine wire. Necking and fracture during formation process of the bonding wire can be avoided by the present method and design to achieve the optimum design for wire bonding profiles.