Taipei, Taiwan

Tien-Jung Huang

This inventor holds 1 USPTO granted patent and 6 published patent applications. Top assignee: Gcsol Tech Co., Ltd.. Active years: 2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tien-Jung Huang. Retrieved from https://idiyas.com/inventor/tien-jung-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2015

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1 patent (USPTO):Explore Patents

Title: Tien-Jung Huang: Innovator in Thermoplastic Resins and Composites

Introduction

Tien-Jung Huang is an inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of thermoplastic resins and high thermally conductive composites. His innovative approaches focus on enhancing material properties for various applications.

Latest Patent Applications

Tien-Jung Huang has filed several patent applications, including:

1. **COMPATIBILIZER AND THERMOPLASTIC RESIN EMPLOYING THE SAME** - This application describes a compatibilizer that includes about 100 parts by weight of polyolefin with at least one reactive functional group, and about 80-120 parts by weight of a copolymer. The copolymer is characterized by specific ratios of repeat units and terminal groups, which are designed to optimize the material's performance.

2. **HIGH THERMALLY CONDUCTIVE COMPOSITES** - This application discloses a high thermally conductive composite that consists of a first composite made of glass fiber distributed in polyphenylene sulfide, and a second composite made of carbon material distributed in polyethylene terephthalate. The carbon material can include graphite, graphene, carbon fiber, carbon nanotubes, or combinations thereof, aimed at improving thermal conductivity.

Conclusion

Tien-Jung Huang is an innovative inventor whose work in thermoplastic resins and composites holds promise for advancements in material science. His latest patent applications reflect his commitment to developing high-performance materials.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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