Tien Cheng

Title: The Innovative Contributions of Tien Cheng

Introduction

Tien Cheng, based in Bedford, NY, has made significant strides in the field of semiconductor technology through his innovative patent. With a focus on interconnect structures, his work showcases a blend of advanced materials and engineering solutions that address critical challenges in integrated circuit design.

Latest Patents

Tien Cheng holds a patent for "Interconnect structures comprising capping layers with low dielectric constants and methods of making the same." This invention provides interconnect structures that feature capping layers with low dielectric constants, excellent oxygen barrier properties, and a comprehensive methodology for their fabrication. The integrated circuit structure includes an interlevel dielectric layer above a semiconductor substrate, a conductive interconnect embedded in this layer, followed by a series of capping layers composed of SiCNH, each engineered to meet specific dielectric constants, thereby enhancing the performance of semiconductor devices.

Career Highlights

Throughout his career, Tien Cheng has worked with prestigious companies, including IBM and Samsung Electronics Co., Ltd. His experience at these leading technology firms has enabled him to refine his expertise in semiconductor research and development, contributing to advancements in the industry.

Collaborations

He has collaborated with notable colleagues, such as Griselda Bonilla and Lawrence Alfred Clevenger, fostering an environment of innovation and teamwork. These collaborations have not only enhanced his own work but have also helped advance the field of integrated circuit technology.

Conclusion

Overall, Tien Cheng's contributions to the field of semiconductor technology and his innovative patent demonstrate his commitment to advancing the industry. His work continues to influence future developments in integrated circuits, solidifying his position as a pivotal figure in innovation and invention.