Company Filing History:
Years Active: 2021-2025
Title: Tiejun Cui: Innovator in Wireless Communication Technologies
Introduction
Tiejun Cui is a prominent inventor based in Nanjing, China. He has made significant contributions to the field of wireless communication technologies. With a total of 2 patents, his work focuses on advanced transmission systems and metamaterials.
Latest Patents
One of Tiejun Cui's latest patents is titled "On-chip dual-mode transmission line with spoof surface plasmon based on balun." This invention features a dual-mode transmission line that can support both odd-mode and even-mode spoof surface plasmon signals. It is designed to be compatible with various chip technologies, including III-V chips like gallium arsenide and silicon nitride. Another notable patent is the "Direct radiation wireless digital communications system and method based on digital coding metamaterial." This system allows for the direct radiation of information into free space using a programmable metamaterial, enhancing communication security and efficiency.
Career Highlights
Tiejun Cui is affiliated with Southeast University, where he continues to advance research in wireless communication. His innovative approaches have garnered attention in the academic and technological communities.
Collaborations
He has collaborated with notable colleagues such as Shuo Liu and Guodong Bai, contributing to various research projects and innovations in the field.
Conclusion
Tiejun Cui's work exemplifies the cutting-edge advancements in wireless communication technologies. His patents reflect a commitment to innovation and the development of secure communication systems.