Nanjing, China

Tie Jun Cui


 

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2017-2019

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4 patents (USPTO):Explore Patents

Title: The Innovations of Tie Jun Cui

Introduction

Tie Jun Cui is a prominent inventor based in Nanjing, China. He has made significant contributions to the field of metamaterials, particularly in the development of innovative surfaces and waveguides. With a total of 4 patents to his name, Cui's work has garnered attention for its potential applications in various technologies.

Latest Patents

Cui's latest patents focus on metamaterials for surfaces and waveguides. These patents describe complementary metamaterial elements that provide effective permittivity and/or permeability for surface structures and waveguide structures. The complementary metamaterial resonant elements include Babinet complements of 'split ring resonator' (SRR) and 'electric LC' (ELC) metamaterial elements. In some approaches, these elements are embedded in the bounding surfaces of planar waveguides, enabling the implementation of waveguide-based gradient index lenses for beam steering and focusing devices, as well as antenna array feed structures.

Career Highlights

Cui is affiliated with Duke University, where he continues to advance research in metamaterials. His work has positioned him as a leading figure in the field, contributing to both academic knowledge and practical applications.

Collaborations

Cui has collaborated with notable colleagues, including David R. Smith and Ruopeng Liu. These partnerships have further enriched his research and expanded the impact of his innovations.

Conclusion

Tie Jun Cui's contributions to the field of metamaterials exemplify the innovative spirit of modern science. His patents and research continue to pave the way for advancements in technology and engineering.

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