Shenzhen, China

Tianzhou Wang

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Tencent Technology (Shenzhen) Company Limited. Active years: 2022-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tianzhou Wang. Retrieved from https://idiyas.com/inventor/tianzhou-wang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2022-2023

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2 patents (USPTO):Explore Patents

Title: Tianzhou Wang: Inventor in Three-Dimensional Object Segmentation.

Introduction

Tianzhou Wang is an inventor based in Shenzhen, China. His patent work includes methods for segmenting three-dimensional objects using computer vision and artificial intelligence technologies. He is associated with Tencent Technology (Shenzhen) Company Limited and has 2 patents.

Latest Patents

Wang’s listed patent, “Method, Device, and Storage Medium for Segmenting Three-Dimensional Object,” describes a technique for improving the segmentation of three-dimensional objects represented as point clouds. The method determines three scaling directions, scales the point positions so the point cloud has the same scale in each direction, and then segments the object using the scaled point cloud. The disclosure covers a method, a device with a processor and memory, and a storage medium containing instructions.

Career Highlights

Wang’s patent activity reflects work in computer vision, a field within artificial intelligence. The described approach addresses differences in scale across three dimensions before object segmentation, providing a standardized point-cloud representation for the segmentation process.

Collaborations

Wang is associated with Tencent Technology (Shenzhen) Company Limited. His listed coworker is Cheng Zhou.

Conclusion

Tianzhou Wang’s patent work focuses on point-cloud processing and three-dimensional object segmentation, with an approach that normalizes scale across three directions before producing a segmentation result.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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