Shenzhen, China

Tianyu Hu

This inventor holds 1 USPTO granted patent. Top assignee: Shenzhen Royole Technologies Co., Ltd.. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tianyu Hu. Retrieved from https://idiyas.com/inventor/tianyu-hu-l450g459

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: The Innovative Journey of Tianyu Hu

Introduction

Tianyu Hu is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of technology, particularly in packaging solutions. His innovative spirit and dedication to his work have led him to develop a noteworthy patent.

Latest Patents

Tianyu Hu holds a patent for a packaging case, showcasing his ability to create practical and efficient solutions. This patent reflects his commitment to enhancing product packaging and improving user experience.

Career Highlights

Tianyu Hu is currently employed at Shenzhen Royole Technologies Co., Ltd. His role at the company allows him to work on cutting-edge technologies and contribute to the advancement of innovative products. With 1 patent to his name, he has established himself as a valuable asset in the field of invention.

Collaborations

Tianyu has collaborated with talented coworkers such as Jianxiong Wu and Zhaohui Li. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Tianyu Hu's journey as an inventor exemplifies the impact of innovation in technology. His work at Shenzhen Royole Technologies Co., Ltd. and his patent for a packaging case highlight his contributions to the industry. Through collaboration and creativity, he continues to pave the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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