Tianyao Wu

Title: Innovations by Tianyao Wu in Wafer Transfer Technology

Introduction

Tianyao Wu is a notable inventor based in Shenyang, China. He has made significant contributions to the field of wafer transfer technology, holding a total of 2 patents. His work focuses on enhancing the efficiency and productivity of wafer handling processes.

Latest Patents

Wu's latest patents include a wafer transfer device and a wafer transfer method. The wafer transfer device comprises a first supporting mechanism and a second supporting mechanism arranged side by side along a translation direction. Each mechanism features picking-conveying guide structures that facilitate the transfer of multiple wafers in two directions. Additionally, the device includes a rotating mechanism that synchronously rotates both supporting mechanisms, thereby extending the picking and conveying range of the wafers. This innovation aims to improve productivity in wafer handling.

Career Highlights

Tianyao Wu is currently employed at Shenyang Kingsemi Co., Ltd., where he continues to develop cutting-edge technologies in the semiconductor industry. His expertise in wafer transfer systems has positioned him as a key player in advancing manufacturing processes.

Collaborations

Wu collaborates with talented colleagues such as Hao Wang and Xinglong Chen, contributing to a dynamic team focused on innovation in wafer technology.

Conclusion

Tianyao Wu's contributions to wafer transfer technology exemplify his commitment to enhancing productivity in the semiconductor industry. His innovative patents reflect a deep understanding of the complexities involved in wafer handling processes.