The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 11, 2025
Filed:
Sep. 24, 2021
Shenyang Kingsemi Co., Ltd., Shenyang, CN;
Tianyao Wu, Shenyang, CN;
Hao Wang, Shenyang, CN;
Xinglong Chen, Shenyang, CN;
Tao Miao, Shenyang, CN;
SHENYANG KINGSEMI Co., Ltd., Shenyang, CN;
Abstract
The present invention provides a wafer transfer device. The wafer transfer device comprises a first supporting mechanism and a second supporting mechanisms, wherein the first supporting mechanism and the second supporting mechanism are arranged side by side along a translation direction, and two opposite outer side walls of the first supporting mechanism and the second supporting mechanism are each provided with a picking-conveying guide structure arranged along a telescopic direction perpendicular to the translation direction; a first picking-conveying mechanism and a second picking-conveying mechanism which are movably arranged at the picking-conveying structure of the first supporting mechanism and the picking-conveying guide structure of the second supporting mechanism respectively, wherein each of the first picking-conveying guide structure and the second picking-conveying guide structure comprises a tail end execution part, and the tail end execution part of the first picking-conveying mechanism and the tail end execution part of the second picking-conveying mechanism are oppositely arranged along a lifting direction and face opposite directions, thus transferring a plurality of wafers in two directions. The present invention further provides a wafer transfer method.