Dongguan, China

Tianming Liu

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Huawei Technologies Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tianming Liu. Retrieved from https://idiyas.com/inventor/tianming-liu-qdiv3t99

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Tianming Liu and Connector Signal Integrity

Introduction

Tianming Liu is an inventor associated with Dongguan, China, and Huawei Technologies Co., Ltd. His patent work includes a connector design intended to improve signal transmission integrity.

Latest Patents

The provided information identifies one patent associated with Liu: “Connector and Electronic Device Having Socket and Plug Assemblies.” The invention describes a socket assembly with a signal port surrounded by a shielding structure, paired with a plug assembly containing a signal terminal and a ground component. When connected, the signal terminal contacts the signal port, while the ground component bonds to the shielding structure. This arrangement is designed to help prevent signal-current return effects, reduce the impact of crosstalk resonance, and improve signal transmission integrity.

Career Highlights

Liu is associated with Huawei Technologies Co., Ltd. The available information lists 1 patent and identifies his work on connector technology.

Collaborations

Ziguo Ma is identified as Liu’s coworker. The provided information does not specify their roles or describe a particular joint project.

Conclusion

Tianming Liu’s listed patent focuses on shielding and grounding in connector assemblies to support more reliable signal transmission.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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