This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Hongli Zhihui Group Co.,ltd.. Active years: 2020.
Company Filing History:
Years Active: 2020
Title: The Innovative Contributions of Tiangang Lv
Introduction
Tiangang Lv is a notable inventor based in Guangdong, China. He has made significant contributions to the field of LED technology, particularly through his innovative methods of packaging CSP LEDs. His work has implications for various applications, including backlighting and light bars.
Latest Patents
Tiangang Lv holds a patent for a method of packaging CSP LEDs. This patent outlines a process that involves placing LED chips on a carrier plate, applying light-blocking or fluorescent glue, and cutting to form CSP LEDs. The method allows for the simultaneous fabrication of multiple LEDs with a single light-emitting surface. This innovative approach simplifies the manufacturing process and effectively prevents yellow light from appearing at the bonding surface of the glue and the chip. The invention results in a CSP LED with the chip covered by packaging glue, while the electrode remains exposed. Additionally, it features three light-emitting surfaces, with light-blocking glue on two sides and fluorescent glue on the remaining surfaces.
Career Highlights
Tiangang Lv is associated with Hongli Zhihui Group Co., Ltd., where he continues to develop and refine his innovative ideas. His work has garnered attention for its practicality and efficiency in LED manufacturing.
Collaborations
Tiangang has collaborated with notable colleagues such as Yi Xiong and Yuefei Wang, contributing to the advancement of LED technology through teamwork and shared expertise.
Conclusion
Tiangang Lv's contributions to the field of LED technology exemplify the impact of innovative thinking in manufacturing processes. His patented methods not only enhance efficiency but also broaden the potential applications of CSP LEDs.