Tianfeng Zhou

Title: Innovations of Tianfeng Zhou in Intravenous Stent Technology

Introduction

Tianfeng Zhou is a notable inventor based in Beijing, China. He has made significant contributions to the field of medical devices, particularly in the development of degradable intravascular stents. His innovative approach combines advanced materials and engineering techniques to enhance the functionality and safety of these medical devices.

Latest Patents

Tianfeng Zhou holds a patent for an "Injection molding method for degradable intravascular stent with flexible mold core structure." This patent outlines a novel injection molding method that includes several key steps. The process begins with winding a metal rod with a flexible metal film and applying an inward bending stress to the film. Following this, the flexible metal film is fixed to the metal rod, and a complementary structure of the degradable intravascular stent is processed on the film's surface. The injection molding processing is then performed, culminating in the removal of the mating body and the formation of the stent.

Career Highlights

Tianfeng Zhou is affiliated with the Beijing Institute of Technology, where he continues to advance his research and development efforts. His work has garnered attention for its potential to improve patient outcomes through innovative medical solutions. With a focus on practical applications, Zhou's inventions aim to address critical challenges in the medical field.

Collaborations

Tianfeng Zhou collaborates with esteemed colleagues such as Tianyang Qiu and Wei Jiang. Their combined expertise fosters a dynamic research environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Tianfeng Zhou's contributions to the field of intravascular stents exemplify the impact of innovation in medical technology. His patent for a novel injection molding method showcases his commitment to improving healthcare solutions. Through his work at the Beijing Institute of Technology, Zhou continues to push the boundaries of what is possible in medical device engineering.