Beijing, China

Tianfeng Pan


Average Co-Inventor Count = 2.4

ph-index = 1


Company Filing History:


Years Active: 2020-2022

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3 patents (USPTO):

Title: The Innovative Contributions of Tianfeng Pan

Introduction

Tianfeng Pan is a prominent inventor based in Beijing, China. He has made significant contributions to the field of display technology, holding a total of 3 patents. His work focuses on innovative packaging solutions and encapsulating methods for display panels.

Latest Patents

Tianfeng Pan's latest patents include a packaging cover plate and manufacturing method, a display panel, and a display device that features a packaging sheet with a shaped plurality of channels. The packaging cover plate consists of a packaging sheet with a first surface and a second surface that are opposite to each other. The first surface is equipped with at least one first channel, while the second surface has at least one second channel. The extension direction of the first channel is parallel to that of the second channel. The arrangement of the channels allows for efficient use of space and enhances the functionality of the packaging sheet. Additionally, he has developed an encapsulating thin film, which includes a protective film and discrete metal film units, designed to encapsulate multiple display panels simultaneously.

Career Highlights

Throughout his career, Tianfeng Pan has worked with notable companies such as Hefei Xinsheng Optoelectronics Technology Co., Ltd. and BOE Technology Group Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to advancements in display technology.

Collaborations

Tianfeng Pan has collaborated with talented individuals in his field, including Lihao Zhao and Biao Tian. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Tianfeng Pan's contributions to display technology through his innovative patents and collaborations highlight his role as a key inventor in the industry. His work continues to influence advancements in packaging and encapsulation methods for display panels.

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